IC & SENSOR PACKAGING TECHNOLOGY EXPO 20 – 22 January, 2021

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services.

Registration on the link below

https://www.nepconjapan.jp/en-gb/about/exhibits/ic-sensor-packaging-technology-expo.html

Date

Jan 20 - 22 2021
Expired!

Time

All Day

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